NSN 5961-00-139-1957
Part Details | UNITIZED SEMICONDUCTOR DEVICES
5961-00-139-1957 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Alternate Parts: 55455359, 554553-59, MSD6150, 19010538, 1901-0538, MSD6150, 5961-00-139-1957, 00-139-1957, 5961001391957, 001391957
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | AUG 09, 1971 | 00-139-1957 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-139-1957
Part Number | Cage Code | Manufacturer |
---|---|---|
554553-59 | 12692 | DIGITAL DEVELOPMENT CORPHAWTHORNE DIV |
MSD6150 | 04713 | FREESCALE SEMICONDUCTOR, INC. |
1901-0538 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
MSD6150 | 55NN2 | MACOM TECHNOLOGY SOLUTIONS INC.DBA M/A-COM |
Technical Data | NSN 5961-00-139-1957
Characteristic | Specifications |
---|---|
COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 135.0 DEG CELSIUS JUNCTION |
INCLOSURE MATERIAL | PLASTIC |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-92 |
MOUNTING METHOD | TERMINAL |
TERMINAL LENGTH | 0.500 INCHES MINIMUM |
TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
OVERALL LENGTH | 0.210 INCHES MAXIMUM |
OVERALL HEIGHT | 0.165 INCHES MAXIMUM |
OVERALL WIDTH | 0.205 INCHES MAXIMUM |
SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |