NSN 5961-00-147-4482

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-00-147-4482 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 26791841, 2679184-1, BC757, 5961-00-147-4482, 00-147-4482, 5961001474482, 001474482

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59SEP 17, 197100-147-448261962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-147-4482
Part Number Cage Code Manufacturer
2679184-121877NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV NAVAL AND MARINE SYSTEMS
BC75701295TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS
Technical Data | NSN 5961-00-147-4482
Characteristic Specifications
COMPONENT NAME AND QUANTITY16 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 DEG CELSIUS JUNCTION
INCLOSURE MATERIAL CERAMIC
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-116
MOUNTING METHOD TERMINAL
TERMINAL LENGTH0.100 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY14 PIN
OVERALL LENGTH0.722 INCHES NOMINAL
OVERALL HEIGHT0.200 INCHES MAXIMUM
OVERALL WIDTH0.300 INCHES NOMINAL
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN