NSN 5961-00-169-2623

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-00-169-2623 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 3008709065101, 3008709-065-101, CMX424, SCMA10066A, VM196, 5961-00-169-2623, 00-169-2623, 5961001692623, 001692623

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59NOV 24, 197100-169-262361962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-169-2623
Part Number Cage Code Manufacturer
3008709-065-10199696LOCKHEED MARTIN CORPORATIONDIV LOCKHEED MARTIN SYSTEMS & GLOBAL
CMX42412969MICRO USPD INC
SCMA10066A14099SEMTECH CORPORATION
VM19660211VOLTAGE MULTIPLIERS INC.DBA V M I
Technical Data | NSN 5961-00-169-2623
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT100.0 DEG CELSIUS AMBIENT AIR
INCLOSURE MATERIAL METAL
MOUNTING METHOD TERMINAL
TERMINAL LENGTH1.120 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY3 UNINSULATED WIRE LEAD
OVERALL LENGTH1.300 INCHES NOMINAL
OVERALL HEIGHT0.280 INCHES NOMINAL
OVERALL WIDTH1.000 INCHES NOMINAL
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN