NSN 5961-00-275-5275

Part Details | SEMICONDUCTOR DEVICE ASSEMBLY

5961-00-275-5275 A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE.

Alternate Parts: 677644011, 67764-401-1, 5961-00-275-5275, 00-275-5275, 5961002755275, 002755275

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 08, 196800-275-527535565 ( SEMICONDUCTOR DEVICE ASSEMBLY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-275-5275
Part Number Cage Code Manufacturer
67764-401-194756BOEING COMPANY, THEDBA BOEING
Technical Data | NSN 5961-00-275-5275
Characteristic Specifications
MAJOR COMPONENTSDIODE 4; PRINTED WIRING BD 1
SPECIAL FEATURESDESIGN ANALYSIS
CRITICALITY CODE JUSTIFICATIONFEAT
NUCLEAR HARDNESS CRITICAL FEATURE HARDENED