NSN 5961-00-275-7576
Part Details | UNITIZED SEMICONDUCTOR DEVICES
5961-00-275-7576 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Alternate Parts: MHQ2222, P3H01235109, P3H012351-09, 1858007, 1858-007, MHQ2222, V515004472, V515-00447-2, 405726, 807521888, 807521-888, SA2061, MHQ2222, MHQ222, 5HQ 2222H, MPQ2222P, MHQ2222, 2139178G001, 1858007, 1858-007, 5961PL0834817, 2201703, L537000238, L537-000-238, 50212600, NSQ2222, MHQ2222, CM0323001, CM0323-001, 019005531, 019-005531, 003007864043, 003-007864-043, P3H01235109, P3H012351-09, 72308924, 723089-24, 5672931, 567293-1, 40512830701, 4051283-0701, 11101019, 10372101, 103721-01, 50715521, 5071552-1, M235A9041, M235A904-1, A1231247, P1950004101, P19500-041-01, 5961-00-275-7576, 00-275-7576, 5961002757576, 002757576
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | AUG 04, 1973 | 00-275-7576 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-275-7576
Part Number | Cage Code | Manufacturer |
---|---|---|
MHQ2222 | C7191 | ADELCO ELEKTRONIK GMBH |
P3H012351-09 | F6116 | ALCATEL CIT DEPARTEMENTCOMMUTATION |
1858-007 | 50434 | AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES |
MHQ2222 | 73138 | BI TECHNOLOGIES CORPORATIONDIV BI TECHNOLOGIES CORP. |
V515-00447-2 | 51215 | BOEING COMPANY, THEDBA BOEING |
405726 | 12909 | CARDION INC |
807521-888 | 53938 | EVANS & SUTHERLAND COMPUTERCORPORATION |
SA2061 | 07933 | FAIRCHILD SEMICONDUCTOR CORPSEMICONDUCTOR DIV HQ |
MHQ2222 | F4597 | FREESCALE SEMICONDUCTEURS FRANCESAS |
MHQ222 | 04713 | FREESCALE SEMICONDUCTOR, INC. |
5HQ 2222H | 04713 | FREESCALE SEMICONDUCTOR, INC. |
MPQ2222P | 04713 | FREESCALE SEMICONDUCTOR, INC. |
MHQ2222 | 04713 | FREESCALE SEMICONDUCTOR, INC. |
2139178G001 | 28527 | HARRIS CORPORATIONDBA ELECTRONIC SYSTEMS, INTEGRATED |
1858-007 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
5961PL0834817 | 9009H | INSPEKTORAT WSPARCIA SIL ZBROJNYCH |
2201703 | 06401 | L3 TECHNOLOGIES, INC.DBA COMMUNICATION SYSTEMS-WEST |
L537-000-238 | 36090 | LOCKHEED MARTIN LIBRASCOPECORP |
50212600 | 19333 | MAGNETIC PERIPHERALS INCNORMANDALE OPNS |
NSQ2222 | 43611 | MICROSEMI CORP.- MASSACHUSETTSDBA MICROSEMI-LAWRENCE |
MHQ2222 | 43611 | MICROSEMI CORP.- MASSACHUSETTSDBA MICROSEMI-LAWRENCE |
CM0323-001 | 22915 | NORTHROP GRUMMAN CORPELECTRONIC SYSTEMS DEFENSIVE SYSTEM |
019-005531 | 26916 | NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV MULTIPLE |
003-007864-043 | 26916 | NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV MULTIPLE |
P3H012351-09 | F4081 | RADIO FREQUENCY SYSTEMS FRANCE |
723089-24 | 05869 | RAYTHEON COMPANYDBA RAYTHEON |
567293-1 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
4051283-0701 | 06845 | RAYTHEON COMPANYDBA RAYTHEON |
11101019 | D0894 | ROHDE & SCHWARZ GMBH & CO. KG |
103721-01 | 14345 | ROLM CORPMIL SPEC COMPUTERS |
5071552-1 | 57958 | SIGNALS WARFARE PROJECT MANAGER |
M235A904-1 | 78711 | TELEPHONICS CORPORATIONDBA COMMUNICATIONS SYSTEMS DIVISION |
A1231247 | F9111 | THALES AVIONICS SAS |
P19500-041-01 | 18876 | U S ARMY AVIATION AND MISSILECOMMAND |
Technical Data | NSN 5961-00-275-7576
Characteristic | Specifications |
---|---|
COMPONENT NAME AND QUANTITY | 4 TRANSISTOR |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
INCLOSURE MATERIAL | CERAMIC |
ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 |
MOUNTING METHOD | TERMINAL |
TERMINAL LENGTH | 0.120 INCHES MINIMUM |
TERMINAL TYPE AND QUANTITY | 14 PIN |
OVERALL LENGTH | 0.785 INCHES MAXIMUM |
OVERALL HEIGHT | 0.280 INCHES MAXIMUM |
OVERALL WIDTH | 0.300 INCHES NOMINAL |
NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
SPECIAL FEATURES | DESIGN ANALYSIS; TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
CRITICALITY CODE JUSTIFICATION | FEAT |