NSN 5961-00-307-4749
Part Details | UNITIZED SEMICONDUCTOR DEVICES
5961-00-307-4749 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Alternate Parts: FSA2565M, FSA2565M, GM820ADD1, 11553621, 11553621, 11553621, 5961-00-307-4749, 00-307-4749, 5961003074749, 003074749
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | OCT 19, 1973 | 00-307-4749 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-307-4749
Part Number | Cage Code | Manufacturer |
---|---|---|
FSA2565M | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
FSA2565M | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
GM820ADD1 | 26512 | NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV MISSION SYSTEMS |
11553621 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
11553621 | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
11553621 | 18876 | U S ARMY AVIATION AND MISSILECOMMAND |
Technical Data | NSN 5961-00-307-4749
Characteristic | Specifications |
---|---|
COMPONENT NAME AND QUANTITY | 13 SEMICONDUCTOR DEVICE DIODE |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
INCLOSURE MATERIAL | PLASTIC |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 |
MOUNTING METHOD | TERMINAL |
TERMINAL LENGTH | 0.125 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
TERMINAL TYPE AND QUANTITY | 14 PIN |
OVERALL LENGTH | 0.640 INCHES MINIMUM AND 0.736 INCHES MAXIMUM |
OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
OVERALL WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |