NSN 5961-00-372-2311

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-00-372-2311 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: AD0052, AD00/52, AD0021, AD00/21, 18550311, 1855-0311, 0345087901, 03450-87901, 18550311, 1855-0311, 0345087901, 03450-87901, SF95005, SF83019, DN196, 5961-00-372-2311, 00-372-2311, 5961003722311, 003722311

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 08, 197400-372-231161962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-372-2311
Part Number Cage Code Manufacturer
AD00/5224355ANALOG DEVICES, INC.DIV CORPORATE HEADQUARTERS
AD00/2124355ANALOG DEVICES, INC.DIV CORPORATE HEADQUARTERS
1855-031150434AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES
03450-8790150434AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES
1855-031128480HEWLETT-PACKARD COMPANYDBA HP
03450-8790128480HEWLETT-PACKARD COMPANYDBA HP
SF9500527014NATIONAL SEMICONDUCTOR CORPORATION
SF8301927014NATIONAL SEMICONDUCTOR CORPORATION
DN19617856SILICONIX INCORPORATEDDIV SILICONIX
Technical Data | NSN 5961-00-372-2311
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 TRANSISTOR
INCLOSURE MATERIAL METAL
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-71
MOUNTING METHOD TERMINAL
TERMINAL LENGTH0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY6 UNINSULATED WIRE LEAD
OVERALL LENGTH0.190 INCHES NOMINAL
OVERALL DIAMETER0.219 INCHES NOMINAL