NSN 5961-00-400-5973
Part Details | TRANSISTOR
5961-00-400-5973 An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.
Alternate Parts: 502575, 18540361, 1854-0361, 425251P, 4-25251P, 106032000000, 106032-000000, B1060320000, B106032-0000, RELEASE5362, 2N4239, 2N4239, 2N4239, 2N4239, 18540361, 1854-0361, 18540361, 1854-0361, 425251P, 4-25251P, 2N4239, 2N4239, 2N4239, 0487970001, 048797-0001, 123623, 123623, SMB651048, 5961-00-400-5973, 00-400-5973, 5961004005973, 004005973
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | MAR 03, 1969 | 00-400-5973 | 20588 ( TRANSISTOR ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-400-5973
Part Number | Cage Code | Manufacturer |
---|---|---|
502575 | 21937 | AMF GEO SPACE CORPSUB OF AMF INC |
1854-0361 | 12436 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC. |
4-25251P | A2608 | BASTOGI SISTEMI SPA |
106032-000000 | 30184 | BUTLER NATIONAL CORP |
B106032-0000 | 30184 | BUTLER NATIONAL CORP |
RELEASE5362 | 80131 | ELECTRONIC INDUSTRIES ASSOCIATION |
2N4239 | 80131 | ELECTRONIC INDUSTRIES ASSOCIATION |
2N4239 | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
2N4239 | 04713 | FREESCALE SEMICONDUCTOR, INC. |
2N4239 | 03877 | GILBERT ENGINEERING CO INC/INCONSUB OF TRANSITRON ELECTRONIC CORP |
1854-0361 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
1854-0361 | 1LQK8 | KEYSIGHT TECHNOLOGIES, INC. |
4-25251P | A0069 | LEONARDO S.P.A. A SECURITY &INFORION SYSTEM DIVISION |
2N4239 | 12969 | MICRO USPD INC |
2N4239 | 5V1P1 | ON SEMICONDUCTOR CORPORATION |
2N4239 | 30043 | SOLID STATE DEVICES, INC. |
048797-0001 | 65597 | THALES DEFENSE & SECURITY, INC. |
123623 | 83311 | UNISON INDUSTRIES, LLC |
123623 | 59501 | UNISON INDUSTRIES, LLC |
SMB651048 | 80063 | US ARMY COMMUNICATIONS &ELECTRONICS MATERIEL READINESS |
Technical Data | NSN 5961-00-400-5973
Characteristic | Specifications |
---|---|
SEMICONDUCTOR MATERIAL | SILICON |
INTERNAL CONFIGURATION | JUNCTION CONTACT |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND 80.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 6.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN |
CURRENT RATING PER CHARACTERISTIC | AC1.00 AMPERES MAXIMUM |
POWER RATING PER CHARACTERISTIC | AB800.0 MILLIWATTS MAXIMUM |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
INCLOSURE MATERIAL | METAL |
ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
MOUNTING METHOD | TERMINAL |
TERMINAL LENGTH | 1.500 INCHES MINIMUM |
TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL |
TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
OVERALL LENGTH | 0.250 INCHES NOMINAL |
OVERALL DIAMETER | 0.360 INCHES NOMINAL |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
SPECIFICATION/STANDARD DATA | 80131-RELESE5362 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |