NSN 5961-00-481-8506

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-00-481-8506 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 6523491, 652-349-1, 6523491, 652-349-1, 6523491, 652-349-1, 10673270, STR3270, 10673270, 5961-00-481-8506, 00-481-8506, 5961004818506, 004818506

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59SEP 11, 197000-481-850661962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-481-8506
Part Number Cage Code Manufacturer
652-349-132306AMPLITRONICS INC
652-349-112969MICRO USPD INC
652-349-11QRL0PC SUPPORT
1067327031338SEMITRONICS CORP
STR327055718SYNTAR INDUSTRIES INC
1067327018876U S ARMY AVIATION AND MISSILECOMMAND
Technical Data | NSN 5961-00-481-8506
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 DEG CELSIUS AMBIENT AIR
INCLOSURE MATERIAL GLASS
MOUNTING METHOD TERMINAL
TERMINAL LENGTH0.600 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY6 UNINSULATED WIRE LEAD
OVERALL LENGTH1.000 INCHES MAXIMUM
OVERALL HEIGHT0.400 INCHES MAXIMUM
OVERALL WIDTH0.630 INCHES MAXIMUM
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN