NSN 5961-00-489-0404

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-00-489-0404 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: 7104069, 7104069, 8563037, 5961-00-489-0404, 00-489-0404, 5961004890404, 004890404

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 17, 197200-489-040461962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-489-0404
Part Number Cage Code Manufacturer
710406917863LITTON SYSTEMS INCGUIDANCE AND CONTROL SYSTEMS DIV
710406906481NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV NAVIGATION AND MARITIME SYSTEMS
856303716170TELEDYNE TECHNOLOGIES INCORPORATEDDBA TELEDYNE MICROELECTRONIC
Technical Data | NSN 5961-00-489-0404
Characteristic Specifications
COMPONENT NAME AND QUANTITY16 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT125.0 DEG CELSIUS AMBIENT AIR
INCLOSURE MATERIAL PLASTIC
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY10 RIBBON
OVERALL LENGTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
OVERALL HEIGHT0.065 INCHES MAXIMUM
OVERALL WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN