NSN 5962-00-234-7278
Part Details | MEMORY MICROCIRCUIT
5962-00-234-7278 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 1018758002, 1018758-002, ROMPROM FAMILY 058, ROM/PROM FAMILY 058, RM44005, RM44-005, HM901862005, HM9-0186-2/005, HM90442005, HM9-044-2/005, HM901862005, HM9-0186-2/005, HM90044C1526, HM9-0044C1526, HM44005, HM44-005, 1018758002, 1018758-002, 5962-00-234-7278, 00-234-7278, 5962002347278, 002347278
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | JUN 20, 1969 | 00-234-7278 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-00-234-7278
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 1018758-002 | 05037 | ANACOMP, INC. |
| ROM/PROM FAMILY 058 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| RM44-005 | 91417 | HARRIS CORPORATIONDBA GOVERNMENT COMMUNICATIONS |
| HM9-0186-2/005 | 1MY79 | INTERSIL COMMUNICATIONS INC. |
| HM9-044-2/005 | 34371 | INTERSIL CORPORATIONDIV NA |
| HM9-0186-2/005 | 34371 | INTERSIL CORPORATIONDIV NA |
| HM9-0044C1526 | 34371 | INTERSIL CORPORATIONDIV NA |
| HM44-005 | 34371 | INTERSIL CORPORATIONDIV NA |
| 1018758-002 | 0HBH2 | LEXEL IMAGING SYSTEMS, INC. |
Technical Data | NSN 5962-00-234-7278
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | GOLD |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.260 INCHES MAXIMUM |
| BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.045 INCHES MAXIMUM |
| BODY WIDTH | 0.150 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | PROGRAMMED AND HERMETICALLY SEALED AND BURN IN |
| TEST DATA DOCUMENT | 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
