NSN 5962-01-041-8705
Part Details | MEMORY MICROCIRCUIT
5962-01-041-8705 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 202059003, 202059-003, ROMPROM FAMILY 038, ROM/PROM FAMILY 038, 5962-01-041-8705, 01-041-8705, 5962010418705, 010418705
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | JUN 01, 1977 | 01-041-8705 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-041-8705
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 202059-003 | 81413 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION I |
| ROM/PROM FAMILY 038 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
Technical Data | NSN 5962-01-041-8705
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV7.0 VOLTS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | HG190.00 MILLIAMPERES MAXIMUM |
| MEMORY DEVICE TYPE | PROM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 1.100 INCHES MINIMUM AND 1.250 INCHES MAXIMUM |
| BODY HEIGHT | 0.160 INCHES MAXIMUM |
| BODY WIDTH | 0.568 INCHES MINIMUM AND 1.250 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.05 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND BIPOLAR |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| END ITEM IDENTIFICATION | AN/APR-38 |
