NSN 5962-01-067-9330
Part Details | HYBRID MICROCIRCUIT
5962-01-067-9330 A circuit in which one type of microcircuit is combined with some other type of microcircuit or with discrete components. For two microcircuits on a common mounting or on each other, see MICROCIRCUIT ASSEMBLY. For microcircuits having a complete independent memory function, see MICROCIRCUIT (1), MEMORY.
Alternate Parts: C574000268, C574000268, C574000268, 5962-01-067-9330, 01-067-9330, 5962010679330, 010679330
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | NOV 10, 1978 | 01-067-9330 | 41014 ( MICROCIRCUIT, HYBRID ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-067-9330
Part Number | Cage Code | Manufacturer |
---|---|---|
C574000268 | 88818 | KEARFOTT CORPORATIONDBA KEARFOTT |
C574000268 | 55267 | RAYTHEON COMPANYDBA RAYTHEON |
C574000268 | 16170 | TELEDYNE TECHNOLOGIES INCORPORATEDDBA TELEDYNE MICROELECTRONIC |
Technical Data | NSN 5962-01-067-9330
Characteristic | Specifications |
---|---|
DESIGN FUNCTION AND QUANTITY | 1 SEQUENCER, MULTIPLEXER |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACVM15.0 VOLTS MINIMUM AND ACV5.0 VOLTS MAXIMUM |
CURRENT RATING PER CHARACTERISTIC | HG230.00 MILLIAMPERES MAXIMUM |
OPERATING TEMP RANGE | -55.0 TO +100.0 DEG CELSIUS |
TERMINAL TYPE AND QUANTITY | 60 FLAT LEADS |
TERMINAL SURFACE TREATMENT | SOLDER |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | METAL |
HYBRID TECHNOLOGY TYPE | MONOLITHIC |
BODY LENGTH | 1.650 INCHES NOMINAL |
BODY HEIGHT | 0.160 INCHES NOMINAL |
BODY WIDTH | 0.890 INCHES NOMINAL |
STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
FEATURES PROVIDED | W/RESET AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
TEST DATA DOCUMENT | 96906-MILS-TD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
END ITEM IDENTIFICATION | F-111D |
PRECIOUS MATERIAL | GOLD |
PRECIOUS MATERIAL AND LOCATION | CASE SURFACES GOLD |