NSN 8040-01-145-1053
Part Details | ADHESIVE
8040-01-145-1053 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: H40, 8040-01-145-1053, 01-145-1053, 8040011451053, 011451053
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 80 | JAN 05, 1983 | 01-145-1053 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-145-1053
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| H40 | 33246 | EPOXY TECHNOLOGY INC. |
Technical Data | NSN 8040-01-145-1053
| Characteristic | Specifications |
|---|---|
| SPECIFIC USAGE DESIGN | BONDING SEMICONDUCTOR CHIPS IN THE FABRICATION OF HYBRID CIRCUITS; DIE ATTACHING MOS CHIPS |
| PHYSICAL FORM | PASTE |
