NSN 8040-01-436-2285
Part Details | ADHESIVE
8040-01-436-2285 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: 50001029000055, 50-00-1029-0000-55, 500010290000, 50-00-1029-0000, CHOBOND 1029, CHO-BOND 1029, 8040-01-436-2285, 01-436-2285, 8040014362285, 014362285
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 80 | SEP 13, 1996 | 01-436-2285 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-436-2285
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 50-00-1029-0000-55 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
| 50-00-1029-0000 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
| CHO-BOND 1029 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
Technical Data | NSN 8040-01-436-2285
| Characteristic | Specifications |
|---|---|
| MATERIAL | SILICONE |
| SPECIFIC USAGE DESIGN | FOR EMI SHIELDING APPLICATIONS |
| COLOR | SILVER |
| PHYSICAL FORM | PASTE |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 3.000 OUNCES |
| SPECIAL FEATURES | SILVER PLATED COPPER FILLER; ELECTRICALLY CONDUCTIVE; SERVICE TEMPERATURE RANGE OF MINUS 67 DEG F TO PLUS 257 DEG F |
| SUPPLEMENTARY FEATURES | 3 OUNCE KIT |
